Beo /Beryllia/Beryllium Oxide Substrate Metallization

• Application: Insulators, Electrical Winding Insulation, Electrical Base, Shell, Insulating Varnish, Switch Baseplate
• Type: Insulation Film
• Chemistry: High Thermal Conductivity
• Material: Eryllium Oxide
• Thermal Rating: 1800 Degree C
• Maximum Voltage: <10KV
• Model NO.: RY-T037
• Classification: Heat Resistance
• Certification: UL, ISO9001, SGS
• Color: White
• Brand: Ry
• Transport Package: PE Bag and Carton
• Specification: customized
• Origin: Hunan
• HS Code: 854710000
• Production Capacity: 10000 PCS Per Month

Product Description

BEO Ceramic substrate
1. Alumina ( Al2O3 substrate )
Al2O3 substrate is the most popular ceramic substrate, with excellent heat
resistance, high mechanical strength , abrasion resistance and small dielectric
loss.The surface of alumina substrate is quite smooth and low porosity.99.6%
alumina substrate is suitable for thin film device, 96% alumina substrate is suitable for thick film device application .
 
2. Aluminium Nitride ( AlN substrate )
Aluminium Nitride has higher thermal conductivity, compared to alumina substrate. It is about 7 to 8 times high. AlN substrate is an excellent electronic package material.
 
3. Zirconia ( ZrO2 substrate )
Compared to alumina substrate, ZrO2 substrate has higher mechanical strength and fracture toughness it's about three times higher for bending strength, two times for fracture toughness than alumina substrate. ZrO2( zirconia ) also provides good abrasion resistance. It features a thermal expansion rate close to metals.
 

Ceramic Substrates Properties
Materials	Al2O3		AlN	ZrO2
	96%	99.60%
Color	White	White	Gray	White
Density (g/cm 3 )	3.72	3.85	3.3	6.04
Thermal conductivity (W/m. K)	22.3	29.5	160 -190	2.4
Thermal Expansion (x10 -6 / o C)	8	8.2	4.6	10
Dielectric strength	1.40E+07	1.80E+07	1.40E+07
Dielectric Constant (at 1MHZ)	9.5	9.8	8.7	29
Loss Tangent (x10 -4 at 1MHZ)	3	2	5	1.00E-03
Volume Resistivity (ohm-m)	>10 14	>10 14	>10 14
Flexural Strength (N/mm 2 )	350	500	450

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