• Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting
  • Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting
  • Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting
  • Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting
  • Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting
  • Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting

Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting

Refractoriness (℃): 1580< Refractoriness< 1770
Feature: Long Time Materials
Type: Heat-Resistant Material
Shape: Plate
Material: Alumina Block
Max Working Temperature: 1600c
Customization:
Manufacturer/Factory & Trading Company

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Basic Info.

Model NO.
RY-AIN03
Rycolor
White, Ivory, Pink
Special
Aluminum Nitride Ceramic Cutting Plates
Product
Aln Ceramic Part
Name
Aln Ceramic Part
Raw Material
Aluminum Nitride Ceramic
Item
Aluminum Nitride Ceramic Insulator
Used
Insulation
Certification
ISO9001-2008/CE
Transport Package
Carton
Specification
According to customer request
Trademark
RY
Origin
China
HS Code
6906000000
Production Capacity
10000PCS Per Month

Product Description

Preparation of the AIN Aluminum nitride Ceramic Substrate by Tape Casting

 

Material: aluminum nitride

 

Feature
 
Very high thermal conductivity

Excellent electrical insulation

Low density

Similar linear expansion coefficient with Si

Extremely high hardness


Product Property : 
Physical Properties

Ceramic Substrates Properties
Materials Al2O3 AlN ZrO2
96% 99%
Color White White Gray White
Density(g/cm3) 3.72 3.85 3.3 6.04
Thermal Conductivity(W/m.k) 22.3 29.5 160-190 2.4
Thermal Expansion(x 10 -6/oC) 8 8 4.6 10
Dielectric Strength 1.40E+07 1.80E+07 1.40E+07 10
Dielectric Constant(at 1MHZ) 9.5 9.8 8.7 29
Loss Tangent(x10 -4 at 1MHZ) 3 2 5 1.00E-03
Volume Resistivity(ohm-m) > 10 14 >10 14 >10 14  
Flexural Strength(N/mm) 350 500 450  



Application
Alumina ceramic is mainly used in large power equipment, IC MOS tube, IGBT chip heat conducting insulation, high frequency power supply, communication, mechanical equipment, strong current, high voltage, high temperature and other
thermal heat insulation parts need products.
Physical properties: high thermal conductivity, high voltage insulation resistance, high temperature resistant, abrasion resistant, high strength.

Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape CastingPreparation of The Ain Aluminum Nitride Ceramic Substrate by Tape CastingPreparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting


Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting



Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting
 

Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting

Preparation of The Ain Aluminum Nitride Ceramic Substrate by Tape Casting

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