Gold Member Since 2016
Audited Supplier
Hunan Rui Yue Industrial and Trade Co., Ltd.

Ceramic Substrate, Alumina Substratre, Electrical Ceramic Substrate manufacturer / supplier in China, offering Ceramic Insulation Plate, Hot Pressed Boron Nitride/Hexagonal Boron Nitride Ceramics, Alumina Ceramic Disc Valve Ceramic Disc for Water Valve and so on.

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Ceramic Insulation Plate

FOB Price: Get Latest Price
Min. Order: 10 Pieces
Port: Shenzhen, China
Production Capacity: 5000000PCS Per Month
Payment Terms: L/C, T/T, D/P, Western Union, Paypal, Money Gram

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Basic Info
  • Model NO.: RY-T068
  • Type: Insulation Film
  • Material: Ceramic
  • Maximum Voltage: 20KV~100KV
  • Certification: UL, ISO9001
  • Brand: Ry
  • Specification: customized
  • HS Code: 854710000
  • Application: Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate
  • Chemistry: Plate Substrate
  • Thermal Rating: 250 250
  • Classification: Hybrid Insulation Materials
  • Color: White
  • Transport Package: Wooden Box Packing
  • Origin: China
Product Description
Ceramic substrate
1. Alumina ( Al2O3 substrate )
Al2O3 substrate is the most popular ceramic substrate, with excellent heat
resistance, high mechanical strength , abrasion resistance and small dielectric
loss.The surface of alumina substrate is quite smooth and low porosity.99.6%
alumina substrate is suitable for thin film device, 96% alumina substrate is suitable for thick film device application .
2. Aluminium Nitride ( AlN substrate )
Aluminium Nitride has higher thermal conductivity, compared to alumina substrate. It is about 7 to 8 times high. AlN substrate is an excellent electronic package material.
3. Zirconia ( ZrO2 substrate )
Compared to alumina substrate, ZrO2 substrate has higher mechanical strength and fracture toughness it's about three times higher for bending strength, two times for fracture toughness than alumina substrate. ZrO2( zirconia ) also provides good abrasion resistance. It features a thermal expansion rate close to metals.
Ceramic Substrates Properties
Density (g/cm 3 )3.723.853.36.04
Thermal conductivity (W/m. K)22.329.5160 -1902.4
Thermal Expansion (x10 -6 / o C)88.24.610
Dielectric strength1.40E+071.80E+071.40E+07 
Dielectric Constant (at 1MHZ)
Loss Tangent (x10 -4 at 1MHZ)3251.00E-03
Volume Resistivity (ohm-m)>10 14>10 14>10 14 
Flexural Strength (N/mm 2 )350500450 





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