• Thermal Conductivity Aluminum Nitride Aln Substrates
  • Thermal Conductivity Aluminum Nitride Aln Substrates
  • Thermal Conductivity Aluminum Nitride Aln Substrates
  • Thermal Conductivity Aluminum Nitride Aln Substrates
  • Thermal Conductivity Aluminum Nitride Aln Substrates

Thermal Conductivity Aluminum Nitride Aln Substrates

Application: Insulators, Electrical Base, Shell, Switch Baseplate
Type: Insulation Sheet
Chemistry: Inorganic Insulation
Material: Aluminium Nitride
Maximum Voltage: 10KV~20KV
Classification: Organic Insulating Material
Customization:
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Basic Info.

Model NO.
RY-119
Certification
ISO9001
Color
Gray
Brand
Ry
Transport Package
Standard Export Packing
Specification
Customized
Origin
China
Production Capacity
100000PCS Per Month

Product Description

Thermal Conductivity Aluminum Nitride AlN Substrates

1)High thermal conductivity of more than 170W/m. K,
2)High resistivity,
3)Low dielectric loss,
4)Good insulation,
5)Some other excellent properties

Material: aluminum nitride

The aln ceramic substrate which has high thermal conductivity of more than 170W/m. K, high resistivity, low dielectric loss, good insulation and some other excellent properties. The ALN substrate is the best choice for a wide range of industrial insulating heat sink material of high power machinery and equipments such as high-frequency equipment substrate, high power transistor module substrate, high-density hybrid circuits, microwave power devices, power semiconductor devices, power electronic devices, optoelectronic components, laser-semi-conductor, LED, IC products, and so on.

Physical Properties

Ceramic Substrates Properties
Materials Al2O3 AlN ZrO2
96% 99%
Color White White Gray White
Density(g/cm3) 3.72 3.85 3.3 6.04
Thermal Conductivity(W/m.k) 22.3 29.5 160-190 2.4
Thermal Expansion(x 10 -6/oC) 8 8 4.6 10
Dielectric Strength 1.40E+07 1.80E+07 1.40E+07 10
Dielectric Constant(at 1MHZ) 9.5 9.8 8.7 29
Loss Tangent(x10 -4 at 1MHZ) 3 2 5 1.00E-03
Volume Resistivity(ohm-m) > 10 14 >10 14 >10 14  
Flexural Strength(N/mm) 350 500 450  

Application
Alumina ceramic is mainly used in large power equipment, IC MOS tube, IGBT chip heat conducting insulation, high frequency power supply, communication, mechanical equipment, strong current, high voltage, high temperature and other
Physical properties: high thermal conductivity, high voltage insulation resistance, high temperature resistant, abrasion resistant, high strength.

Thermal Conductivity Aluminum Nitride Aln Substrates
Thermal Conductivity Aluminum Nitride Aln Substrates
Thermal Conductivity Aluminum Nitride Aln Substrates
Thermal Conductivity Aluminum Nitride Aln Substrates


 

3:Workshop Photo:

Thermal Conductivity Aluminum Nitride Aln Substrates
4:Our Service:
Thermal Conductivity Aluminum Nitride Aln Substrates

5:What can we do for you?

 

1. Sample is available.

2. Independent R&D, ISO manufacture, precise quality standards, modern logistics management, and sound marketing strategy.

3. Inquiry replied within 24 hours.

4. Patented products.

5. OEM or ODM is available.

6. Some extra accessories can be supplied.

7.The larger quantity you order,the more competitive prices you'll get.

8. Necessary Certificates can be supplied.

 

 

9:Why To Choose Us

1. Low MOQ:

   It won't occupy too much of your money to help you to test the market you're going to enter.

2. R & D Center and Factory:

   We have our own R & D center and factory, so we can supply you products at competitive price.

3. Good Service :

   We treat clients as friends.

4. Good Quality : 

   We import top quality accessories to manufacture our products, we have confident we can offer you the best quality.  

5. After-sales service: 

 

   One year's guarantee. Wearing accessories comes with the products to help you to reduce the repair bill.

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