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ALN aluminum nitride ceramic substrate,Industrial ceramics,structure ceramic products
ALN ceramic substrate
1)High thermal conductivity of more than 170W/m. K,
2)High resistivity,
3)Low dielectric loss,
4)Good insulation,
5)Some other excellent properties
Material: aluminum nitride
The aln ceramic substrate which has high thermal conductivity of more than 170W/m. K, high resistivity, low dielectric loss, good insulation and some other excellent properties. The ALN substrate is the best choice for a wide range of industrial insulating heat sink material of high power machinery and equipments such as high-frequency equipment substrate, high power transistor module substrate, high-density hybrid circuits, microwave power devices, power semiconductor devices, power electronic devices, optoelectronic components, laser-semi-conductor, LED, IC products, and so on.
Physical Properties
| Ceramic Substrates Properties | ||||
| Materials | Al2O3 | AlN | ZrO2 | |
| 96% | 99% | |||
| Color | White | White | Gray | White |
| Density(g/cm3) | 3.72 | 3.85 | 3.3 | 6.04 |
| Thermal Conductivity(W/m.k) | 22.3 | 29.5 | 160-190 | 2.4 |
| Thermal Expansion(x 10 -6/oC) | 8 | 8 | 4.6 | 10 |
| Dielectric Strength | 1.40E+07 | 1.80E+07 | 1.40E+07 | 10 |
| Dielectric Constant(at 1MHZ) | 9.5 | 9.8 | 8.7 | 29 |
| Loss Tangent(x10 -4 at 1MHZ) | 3 | 2 | 5 | 1.00E-03 |
| Volume Resistivity(ohm-m) | > 10 14 | >10 14 | >10 14 | |
| Flexural Strength(N/mm) | 350 | 500 | 450 | |
Application
Alumina ceramic is mainly used in large power equipment, IC MOS tube, IGBT chip heat conducting insulation, high frequency power supply, communication, mechanical equipment, strong current, high voltage, high temperature and other
thermal heat insulation parts need products.
Physical properties: high thermal conductivity, high voltage insulation resistance, high temperature resistant, abrasion resistant, high strength.
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