| Customization: | Available |
|---|---|
| Type: | Combining Rigid Circuit Board |
| Dielectric: | Ceramic |
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Metallized Alumina al2o3 Ceramic Substrate/DBC Substrate Plate
Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm
Data Sheet :
| Material | 85 Al2o3 | 90 Al2o3 | 95 Al2o3 | 99 Al2o3 |
| Al2o3 | 85% | 90% | 93% | 99.30% |
| Fe2o3 | ≤ 1.0 | ≤ 0.5 | ≤ 0.5 | ≤ 0.3 |
| Desnsity: g / cm3 | 3.4 | 3.5 | 3.6 | 3.85 |
| Vickers Hardness | ≥ 8.6 | ≥ 8.8 | 9 | 9 |
| Water Absorption:% | ≤ 0.2 | ≤ 0.1 | ≤ 0.085 | ≤ 0.01 |
| Refractoriness:°C | 1580 °C | 1600 °C | 1650 °C | 1800°C |
| Flexural Strength:Mpa | 180 | 200 | 240 | 280 |
|
Wear Rate( at room temperature, erosion, 100 grinding)% |
≤ 3 | ≤ 2.5 | ≤ 1 | ≤ 0.5 |
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