• Insulation Ceramic Alumina Al2O3 Substrates
  • Insulation Ceramic Alumina Al2O3 Substrates
  • Insulation Ceramic Alumina Al2O3 Substrates
  • Insulation Ceramic Alumina Al2O3 Substrates
  • Insulation Ceramic Alumina Al2O3 Substrates
  • Insulation Ceramic Alumina Al2O3 Substrates

Insulation Ceramic Alumina Al2O3 Substrates

Refractoriness (℃): 1580< Refractoriness< 1770
Feature: Long Time Materials
Type: Heat-Resistant Material
Shape: Plate
Material: Alumina Cement
Special: Thin Film Alumina Ceramic
Customization:
Diamond Member Since 2016

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Manufacturer/Factory & Trading Company

Basic Info.

Processing Technology
Delay Pressure Foil
Insulation Materials
Metal Composite Materials
Transport Package
Standard Plate Packing
Specification
According to customer request
Trademark
RY
Origin
China
HS Code
8547100000
Production Capacity
50000per Month

Product Description

Insulation Ceramic Alumina Al2O3 SubstratesInsulation Ceramic Alumina Al2O3 Substrates
Insulation Ceramic Alumina Al2O3 Substrates
Insulation Ceramic Alumina Al2O3 Substrates



Supply alumina ceramic substrate:
Thickness: 0.3 - 2mm
Size: 10 - 300mm, According to drawing.

Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm

 Data Sheet : 
 

Material 85 Al2o3 90 Al2o3 95 Al2o3 99 Al2o3
Al2o3 85% 90% 93% 99.30%
Fe2o3 ≤ 1.0 ≤ 0.5 ≤ 0.5 ≤ 0.3
Desnsity: g / cm3 3.4 3.5 3.6 3.85
Vickers Hardness ≥ 8.6 ≥ 8.8 9 9
Water Absorption:% ≤ 0.2 ≤ 0.1 ≤ 0.085 ≤ 0.01
Refractoriness:°C 1580 °C 1600 °C 1650 °C 1800°C
Flexural Strength:Mpa 180 200 240 280

Wear Rate( at room temperature, 

erosion, 100 grinding)%

≤ 3 ≤ 2.5 ≤ 1 ≤ 0.5
Test Items Technical Parameters Test Conditions
Printing layer/Coating graphic Keep in conformity with the product drawing 10 x microscope
Printing layer/Coating thickness Keep in conformity with the product drawing X ray fluorescence thickness gauge
Drying-out resistance No defects on printing layer/ coating surface such as blisters, discolor, peeling Heating on heating board 300ºC/5min
Solder invasive Invasive area≥95%  260±5ºC/5±1 Sec immersion tin
Soldering resistance Unilateral adhered tin 75μm 260±5ºC/10±1 Sec immersion tin
Tension Printing layer >20gf Welding plate crossed φ130μm Cu
Adhesion Not stripping Tape cling to the surface with 3M#600, speed tear in the direction 90ºC after 30sec


Insulation Ceramic Alumina Al2O3 Substrates
 

 

1. Low MOQ:

   It won't occupy too much of your money to help you to test the market you're going to enter.

2. R & D Center and Factory:

   We have our own R & D center and factory, so we can supply you products at competitive price.

3. Good Service :

   We treat clients as friends.

4. Good Quality : 

   We import top quality accessories to manufacture our products, we have confident we can offer you the best quality.  

5. After-sales service: 

   One year's guarantee. Wearing accessories comes with the products to help you to reduce the repair bill.

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