Aln Al2O3 Alumina Dbc Substrate Aluminum Nitride Direct Bond Copper Substrate

• Customization: Available
• Type: Combining Rigid Circuit Board
• Dielectric: Ceramic
• Model NO.: RY-C631
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Delay Pressure Foil
• Base Material: Alumina Ceramic
• Insulation Materials: Metal Composite Materials
• Model: PCB
• Brand: Ry
• Max Working Temperature: 1600c
• Rycolor: White, Ivory, Pink
• Special: Thin Film Alumina Ceramic
• Product: Alumina Parts
• Name: Machine Alumina Ceramic Substrate
• Raw Material: 60-99.7% Alumina Ceramic
• Item: Alumina Ceramics Dbc Substrate
• Transport Package: Carton
• Specification: According to customer request
• Trademark: RY
• Origin: China
• HS Code: 854710000
• Production Capacity: 10000PCS Per Month

Product Description

 Aluminum Nitride Direct Bond 



Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm

 Data Sheet : 
 

Material	85 Al2o3	90 Al2o3	95 Al2o3	99 Al2o3
Al2o3	85%	90%	93%	99.30%
Fe2o3	≤ 1.0	≤ 0.5	≤ 0.5	≤ 0.3
Desnsity: g / cm3	3.4	3.5	3.6	3.85
Vickers Hardness	≥ 8.6	≥ 8.8	9	9
Water Absorption:%	≤ 0.2	≤ 0.1	≤ 0.085	≤ 0.01
Refractoriness:°C	1580 °C	1600 °C	1650 °C	1800°C
Flexural Strength:Mpa	180	200	240	280
Wear Rate( at room temperature,  erosion, 100 grinding)%	≤ 3	≤ 2.5	≤ 1	≤ 0.5