| Customization: | Available |
|---|---|
| Feature: | Long Time Materials, Instant Materials, Wear Resistance |
| Refractoriness (℃): | 1580< Refractoriness< 1770 |
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Features:
Supply alumina ceramic substrate:
Thickness: 0.3 - 2mm
Size: 10 - 300mm, According to drawing.
Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm
Data Sheet :
| Material | 85 Al2o3 | 90 Al2o3 | 95 Al2o3 | 99 Al2o3 |
| Al2o3 | 85% | 90% | 93% | 99.30% |
| Fe2o3 | ≤ 1.0 | ≤ 0.5 | ≤ 0.5 | ≤ 0.3 |
| Desnsity: g / cm3 | 3.4 | 3.5 | 3.6 | 3.85 |
| Vickers Hardness | ≥ 8.6 | ≥ 8.8 | 9 | 9 |
| Water Absorption:% | ≤ 0.2 | ≤ 0.1 | ≤ 0.085 | ≤ 0.01 |
| Refractoriness:°C | 1580 °C | 1600 °C | 1650 °C | 1800°C |
| Flexural Strength:Mpa | 180 | 200 | 240 | 280 |
|
Wear Rate( at room temperature, erosion, 100 grinding)% |
≤ 3 | ≤ 2.5 | ≤ 1 | ≤ 0.5 |
| Test Items | Technical Parameters | Test Conditions |
| Printing layer/Coating graphic | Keep in conformity with the product drawing | 10 x microscope |
| Printing layer/Coating thickness | Keep in conformity with the product drawing | X ray fluorescence thickness gauge |
| Drying-out resistance | No defects on printing layer/ coating surface such as blisters, discolor, peeling | Heating on heating board 300ºC/5min |
| Solder invasive | Invasive area≥95% | 260±5ºC/5±1 Sec immersion tin |
| Soldering resistance | Unilateral adhered tin 75μm | 260±5ºC/10±1 Sec immersion tin |
| Tension | Printing layer >20gf | Welding plate crossed φ130μm Cu |
| Adhesion | Not stripping | Tape cling to the surface with 3M#600, speed tear in the direction 90ºC after 30sec |
2:Application:
1.The Plate Is Mainly Used In High-Density Hybrid Circuits,Microwave Power
Devices, Power Semiconductor Devices,Power Electronic Devices,
Optoelectronic Components,Semiconductor Refrigeration Products Such As
Substrates For High-Performance Materials And Packaging Materials
INQUIRIES WELCOMED !
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